Socket for use with a micro-component in a light-emitting panel

ABSTRACT

An improved light-emitting panel having a plurality of micro-components at least partially disposed in a socket and sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes.

CROSS-REFERENCE TO RELATED APPLICATIONS

The current application is a continuation application of U.S. patentapplication Ser. No. 11/135,538, which is a divisional application ofU.S. Pat. No. 6,902,456 (application Ser. No. 10/643,608), which is acontinuation application of U.S. Pat. No. 6,646,388 (application Ser.No. 10/318,150), filed Dec. 13, 2002 and titled Socket for Use with aMicro-Component in a Light-Emitting Panel which is a continuation ofsimilarly titled U.S. Pat. No. 6,545,422 filed Oct. 27, 2000. Thefollowing applications filed on the same date as the present applicationare herein incorporated by reference: U.S. patent application Ser. No.09/697,358 entitled A Micro-Component for Use in a Light-Emitting Panelfiled Oct. 27, 2000; U.S. patent application Ser. No. 09/697,498entitled A Method for Testing a Light-Emitting Panel and the ComponentsTherein filed Oct. 27, 2000; U.S. patent application Ser. No. 09/697,345entitled A Method and System for Energizing a Micro-Component In aLight-Emitting Panel filed Oct. 27, 2000; and U.S. patent applicationSer. No. 09/697,344 entitled A Light-Emitting Panel and a Method ofMaking filed Oct. 27, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a light-emitting panel and methods offabricating the same. The present invention further relates to a socket,for use in a light-emitting panel, in which a micro-component is atleast partially disposed.

2. Description of Related Art

In a typical plasma display, a gas or mixture of gases is enclosedbetween orthogonally crossed and spaced conductors. The crossedconductors define a matrix of cross over points, arranged as an array ofminiature picture elements (pixels), which provide light. At any givenpixel, the orthogonally crossed and spaced conductors function asopposed plates of a capacitor, with the enclosed gas serving as adielectric. When a sufficiently large voltage is applied, the gas at thepixel breaks down creating free electrons that are drawn to the positiveconductor and positively charged gas ions that are drawn to thenegatively charged conductor. These free electrons and positivelycharged gas ions collide with other gas atoms causing an avalancheeffect creating still more free electrons and positively charged ions,thereby creating plasma. The voltage level at which this ionizationoccurs is called the write voltage.

Upon application of a write voltage, the gas at the pixel ionizes andemits light only briefly as free charges formed by the ionizationmigrate to the insulating dielectric walls of the cell where thesecharges produce an opposing voltage to the applied voltage and therebyextinguish the ionization. Once a pixel has been written, a continuoussequence of light emissions can be produced by an alternating sustainvoltage. The amplitude of the sustain waveform can be less than theamplitude of the write voltage, because the wall charges that remainfrom the preceding write or sustain operation produce a voltage thatadds to the voltage of the succeeding sustain waveform applied in thereverse polarity to produce the ionizing voltage. Mathematically, theidea can be set out as V_(s)=V_(w)−V _(wal1), where V_(s) is the sustainvoltage, V_(w) is the write voltage, and V_(wall) is the wall voltage.Accordingly, a previously unwritten (or erased) pixel cannot be ionizedby the sustain waveform alone. An erase operation can be thought of as awrite operation that proceeds only far enough to allow the previouslycharged cell walls to discharge; it is similar to the write operationexcept for timing and amplitude.

Typically, there are two different arrangements of conductors that areused to perform the write, erase, and sustain operations. The one commonelement throughout the arrangements is that the sustain and the addresselectrodes are spaced apart with the plasma-forming gas in between.Thus, at least one of the address or sustain electrodes is locatedwithin the path the radiation travels, when the plasma-forming gasionizes, as it exits the plasma display. Consequently, transparent orsemi-transparent conductive materials must be used, such as indium tinoxide (ITO), so that the electrodes do not interfere with the displayedimage from the plasma display. Using ITO, however, has severaldisadvantages, for example, ITO is expensive and adds significant costto the manufacturing process and ultimately the final plasma display.

The first arrangement uses two orthogonally crossed conductors, oneaddressing conductor and one sustaining conductor. In a gas panel ofthis type, the sustain waveform is applied across all the addressingconductors and sustain conductors so that the gas panel maintains apreviously written pattern of light emitting pixels. For a conventionalwrite operation, a suitable write voltage pulse is added to the sustainvoltage waveform so that the combination of the write pulse and thesustain pulse produces ionization. In order to write an individual pixelindependently, each of the addressing and sustain conductors has anindividual selection circuit. Thus, applying a sustain waveform acrossall the addressing and sustain conductors, but applying a write pulseacross only one addressing and one sustain conductor will produce awrite operation in only the one pixel at the intersection of theselected addressing and sustain conductors.

The second arrangement uses three conductors. In panels of this type,called coplanar sustaining panels, each pixel is formed at theintersection of three conductors, one addressing conductor and twoparallel sustaining conductors. In this arrangement, the addressingconductor orthogonally crosses the two parallel sustaining conductors.With this type of panel, the sustain function is performed between thetwo parallel sustaining conductors and the addressing is done by thegeneration of discharges between the addressing conductor and one of thetwo parallel sustaining conductors.

The sustaining conductors are of two types, addressing-sustainingconductors and solely sustaining conductors. The function of theaddressing-sustaining conductors is twofold: to achieve a sustainingdischarge in cooperation with the solely sustaining conductors; and tofulfill an addressing role. Consequently, the addressing-sustainingconductors are individually selectable so that an addressing waveformmay be applied to any one or more addressing-sustaining conductors. Thesolely sustaining conductors, on the other hand, are typically connectedin such a way that a sustaining waveform can be simultaneously appliedto all of the solely sustaining conductors so that they can be carriedto the same potential in the same instant.

Numerous types of plasma panel display devices have been constructedwith a variety of methods for enclosing a plasma forming gas betweensets of electrodes. In one type of plasma display panel, parallel platesof glass with wire electrodes on the surfaces thereof are spaceduniformly apart and sealed together at the outer edges with the plasmaforming gas filling the cavity formed between the parallel plates.Although widely used, this type of open display structure has variousdisadvantages. The sealing of the outer edges of the parallel plates andthe introduction of the plasma forming gas are both expensive andtime-consuming processes, resulting in a costly end product. Inaddition, it is particularly difficult to achieve a good seal at thesites where the electrodes are fed through the ends of the parallelplates. This can result in gas leakage and a shortened productlifecycle. Another disadvantage is that individual pixels are notsegregated within the parallel plates. As a result, gas ionizationactivity in a selected pixel during a write operation may spill over toadjacent pixels, thereby raising the undesirable prospect of possiblyigniting adjacent pixels. Even if adjacent pixels are not ignited, theionization activity can change the turn-on and turn-off characteristicsof the nearby pixels.

In another type of known plasma display, individual pixels aremechanically isolated either by forming trenches in one of the parallelplates or by adding a perforated insulating layer sandwiched between theparallel plates. These mechanically isolated pixels, however, are notcompletely enclosed or isolated from one another because there is a needfor the free passage of the plasma forming gas between the pixels toassure uniform gas pressure throughout the panel. While this type ofdisplay structure decreases spill over, spill over is still possiblebecause the pixels are not in total electrical isolation from oneanother. In addition, in this type of display panel it is difficult toproperly align the electrodes and the gas chambers, which may causepixels to misfire. As with the open display structure, it is alsodifficult to get a good seal at the plate edges. Furthermore, it isexpensive and time consuming to introduce the plasma producing gas andseal the outer edges of the parallel plates.

In yet another type of known plasma display, individual pixels are alsomechanically isolated between parallel plates. In this type of display,the plasma forming gas is contained in transparent spheres formed of aclosed transparent shell. Various methods have been used to contain thegas filled spheres between the parallel plates. In one method, spheresof varying sizes are tightly bunched and randomly distributed throughouta single layer, and sandwiched between the parallel plates. In a secondmethod, spheres are embedded in a sheet of transparent dielectricmaterial and that material is then sandwiched between the parallelplates. In a third method, a perforated sheet of electricallynonconductive material is sandwiched between the parallel plates withthe gas filled spheres distributed in the perforations.

While each of the types of displays discussed above are based ondifferent design concepts, the manufacturing approach used in theirfabrication is generally the same. Conventionally, a batch fabricationprocess is used to manufacture these types of plasma panels. As is wellknown in the art, in a batch process individual component parts arefabricated separately, often in different facilities and by differentmanufacturers, and then brought together for final assembly whereindividual plasma panels are created one at a time. Batch processing hasnumerous shortcomings, such as, for example, the length of timenecessary to produce a finished product. Long cycle times increaseproduct cost and are undesirable for numerous additional reasons knownin the art. For example, a sizeable quantity of substandard, defective,or useless fully or partially completed plasma panels may be producedduring the period between detection of a defect or failure in one of thecomponents and an effective correction of the defect or failure.

This is especially true of the first two types of displays discussedabove; the first having no mechanical isolation of individual pixels,and the second with individual pixels mechanically isolated either bytrenches formed in one parallel plate or by a perforated insulatinglayer sandwiched between two parallel plates. Due to the fact thatplasma-forming gas is not isolated at the individual pixel/subpixellevel, the fabrication process precludes the majority of individualcomponent parts from being tested until the final display is assembled.Consequently, the display can only be tested after the two parallelplates are sealed together and the plasma-forming gas is filled insidethe cavity between the two plates. If post production testing shows thatany number of potential problems have occurred, (e.g. poor luminescenceor no luminescence at specific pixels/subpixels) the entire display isdiscarded.

BRIEF SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide a light-emittingpanel that may be used as a large-area radiation source, for energymodulation, for particle detection and as a flat-panel display.Gas-plasma panels are preferred for these applications due to theirunique characteristics.

In one basic form, the light-emitting panel may be used as a large arearadiation source. By configuring the light-emitting panel to emitultraviolet (UV) light, the panel has application for curing, painting,and sterilization. With the addition of a white phosphor coating toconvert the UV light to visible white light, the panel also hasapplication as an illumination source.

In addition, the light-emitting panel may be used as a plasma-switchedphase array by configuring the panel in at least one embodiment in amicrowave transmission mode. The panel is configured in such a way thatduring ionization the plasma-forming gas creates a localized index ofrefraction change for the microwaves (although other wavelengths oflight would work). The microwave beam from the panel can then be steeredor directed in any desirable pattern by introducing at a localized areaa phase shift and/or directing the microwaves out of a specific aperturein the panel

Additionally, the light-emitting panel may be used for particle/photondetection. In this embodiment, the light-emitting panel is subjected toa potential that is just slightly below the write voltage required forionization. When the device is subjected to outside energy at a specificposition or location in the panel, that additional energy causes theplasma forming gas in the specific area to ionize, thereby providing ameans of detecting outside energy.

Further, the light-emitting panel may be used in flat-panel displays.These displays can be manufactured very thin and lightweight, whencompared to similar sized cathode ray tube (CRTs), making them ideallysuited for home, office, theaters and billboards. In addition, thesedisplays can be manufactured in large sizes and with sufficientresolution to accommodate high-definition television (HDTV). Gas-plasmapanels do not suffer from electromagnetic distortions and are,therefore, suitable for applications strongly affected by magneticfields, such as military applications, radar systems, railway stationsand other underground systems.

According to a general embodiment of the present invention, alight-emitting panel is made from two substrates, wherein one of thesubstrates includes a plurality of sockets and wherein at least twoelectrodes are disposed. At least partially disposed in each socket is amicro-component, although more than one micro-component may be disposedtherein. Each micro-component includes a shell at least partially filledwith a gas or gas mixture capable of ionization. When a large enoughvoltage is applied across the micro-component the gas or gas mixtureionizes forming plasma and emitting radiation. Various embodiments ofthe present invention are drawn to different socket structures.

In one embodiment of the present invention, a cavity is patterned on asubstrate such that it is formed in the substrate. In anotherembodiment, a plurality of material layers form a substrate and aportion of the material layers is selectively removed to form a cavity.In another embodiment, a cavity is patterned on a substrate so that thecavity is formed in the substrate and a plurality of material layers aredisposed on the substrate such that the material layers conform to theshape of the cavity. In another embodiment, a plurality of materiallayers, each including an aperture, are disposed on a substrate. In thisembodiment, the material layers are disposed so that the apertures arealigned, thereby forming a cavity. Other embodiments are directed tomethods for forming the sockets described above.

Each socket includes at least two electrodes that are arranged sovoltage applied to the two electrodes causes one or moremicro-components to emit radiation. In an embodiment of the presentinvention, the at least two electrodes are adhered to only the firstsubstrate, only the second substrate, or at least one electrode isadhered to the first substrate and at least one electrode is adhered tothe second substrate. In another embodiment, the at least two electrodesare arranged so that the radiation emitted from the micro-component whenenergized is emitted throughout the field of view of the light-emittingpanel such that the radiation does not cross the two electrodes. Inanother embodiment, at least one electrode is disposed within thematerial layers.

A cavity can be any shape or size. In an embodiment, the shape of thecavity is selected from a group consisting of a cube, a cone, a conicalfrustum, a paraboloid, spherical, cylindrical, a pyramid, a pyramidalfrustum, a parallelepiped, and a prism. In another embodiment, a socketand a micro-component are described with a male-female connector typeconfiguration. In this embodiment, the micro-component and the cavityhave complimentary shapes, wherein the opening of the cavity is smallerthan the diameter of the micro-component so that when themicro-component is disposed in the cavity the micro-component is held inplace by the cavity.

The size and shape of the socket influences the performance andcharacteristics of the display and may be chosen, for example, tooptimize the panel's efficiency of operation. In addition, the size andshape of the socket may be chosen to optimize photon generation andprovide increased luminosity and radiation transport efficiency.Further, socket geometry may be selected based on the shape and size ofthe micro-component to optimize the surface contact between themicro-component and the socket and/or to ensure connectivity of themicro-component and any electrodes disposed within the socket. In anembodiment, the inside of a socket is coated with a reflective material,which provides an increase in luminosity.

Other features, advantages, and embodiments of the invention are setforth in part in the description that follows, and in part, will beobvious from this description, or may be learned from the practice ofthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of this invention willbecome more apparent by reference to the following detailed descriptionof the invention taken in conjunction with the accompanying drawings.

FIG. 1 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate, asdisclosed in an embodiment of the present invention.

FIG. 2 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate, asdisclosed in another embodiment of the present invention.

FIG. 3A shows an example of a cavity that has a cube shape.

FIG. 3B shows an example of a cavity that has a cone shape.

FIG. 3C shows an example of a cavity that has a conical frustum shape.

FIG. 3D shows an example of a cavity that has a paraboloid shape.

FIG. 3E shows an example of a cavity that has a spherical shape.

FIG. 3F shows an example of a cavity that has a cylindrical shape.

FIG. 3G shows an example of a cavity that has a pyramid shape.

FIG. 3H shows an example of a cavity that has a pyramidal frustum shape.

FIG. 31 shows an example of a cavity that has a parallelepiped shape.

FIG. 3J shows an example of a cavity that has a prism shape.

FIG. 4 shows the socket structure from a light-emitting panel of anembodiment of the present invention with a narrower field of view.

FIG. 5 shows the socket structure from a light-emitting panel of anembodiment of the present invention with a wider field of view.

FIG. 6A depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from disposing a plurality ofmaterial layers and then selectively removing a portion of the materiallayers with the electrodes having a co-planar configuration.

FIG. 6B is a cut-away of FIG. 6A showing in more detail the co-planarsustaining electrodes.

FIG. 7A depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from disposing a plurality ofmaterial layers and then selectively removing a portion of the materiallayers with the electrodes having a mid-plane configuration.

FIG. 7B is a cut-away of FIG. 7A showing in more detail the uppermostsustain electrode.

FIG. 8 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from disposing a plurality ofmaterial layers and then selectively removing a portion of the materiallayers with the electrodes having an configuration with two sustain andtwo address electrodes, where the address electrodes are between the twosustain electrodes.

FIG. 9 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate and thendisposing a plurality of material layers on the substrate so that thematerial layers conform to the shape of the cavity with the electrodeshaving a co-planar configuration.

FIG. 10 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate and thendisposing a plurality of material layers on the substrate so that thematerial layers conform to the shape of the cavity with the electrodeshaving a mid-plane configuration.

FIG. 11 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate and thendisposing a plurality of material layers on the substrate so that thematerial layers conform to the shape of the cavity with the electrodeshaving a configuration with two sustain and two address electrodes,where the address electrodes are between the two sustain electrodes.

FIG. 12 shows a portion of a socket of an embodiment of the presentinvention where the micro-component and the cavity are formed as a typeof male-female connector.

FIG. 13 shows an exploded view of a portion of a light-emitting panelshowing the basic socket structure of a socket formed by disposing aplurality of material layers with aligned apertures on a substrate withthe electrodes having a co-planar configuration.

FIG. 14 shows an exploded view of a portion of a light-emitting panelshowing the basic socket structure of a socket formed by disposing aplurality of material layers with aligned apertures on a substrate withthe electrodes having a mid-plane configuration.

FIG. 15 shows an exploded view of a portion of a light-emitting panelshowing the basic socket structure of a socket formed by disposing aplurality of material layers with aligned apertures on a substrate withelectrodes having a configuration with two sustain and two addresselectrodes, where the address electrodes are between the two sustainelectrodes.

DETAILED DESCRIPTION OF THE PREFERRRED EMBODIMENTS OF THE INVENTION

As embodied and broadly described herein, the preferred embodiments ofthe present invention are directed to a novel light-emitting panel. Inparticular, the preferred embodiments are directed to a socket capableof being used in the light-emitting panel and supporting at least onemicro-component.

FIGS. 1 and 2 show two embodiments of the present invention wherein alight-emitting panel includes a first substrate 10 and a secondsubstrate 20. The first substrate 10 may be made from silicates,polypropylene, quartz, glass, any polymeric-based material or anymaterial or combination of materials known to one skilled in the art.Similarly, second substrate 20 may be made from silicates,polypropylene, quartz, glass, any polymeric-based material or anymaterial or combination of materials known to one skilled in the art.First substrate 10 and second substrate 20 may both be made from thesame material or each of a different material. Additionally, the firstand second substrate may be made of a material that dissipates heat fromthe light-emitting panel. In a preferred embodiment, each substrate ismade from a material that is mechanically flexible.

The first substrate 10 includes a plurality of sockets 30. The sockets30 may be disposed in any pattern, having uniform or non-uniform spacingbetween adjacent sockets. Patterns may include, but are not limited to,alphanumeric characters, symbols, icons, or pictures. Preferably, thesockets 30 are disposed in the first substrate 10 so that the distancebetween adjacent sockets 30 is approximately equal. Sockets 30 may alsobe disposed in groups such that the distance between one group ofsockets and another group of sockets is approximately equal. This latterapproach may be particularly relevant in color light-emitting panels,where each socket in each group of sockets may represent red, green andblue, respectively.

At least partially disposed in each socket 30 is at least onemicro-component 40. Multiple micro-components 40 may be disposed in asocket to provide increased luminosity and enhanced radiation transportefficiency. In a color light-emitting panel according to one embodimentof the present invention, a single socket supports threemicro-components configured to emit red, green, and blue light,respectively. The micro-components 40 may be of any shape, including,but not limited to, spherical, cylindrical, and aspherical. In addition,it is contemplated that a micro-component 40 includes a micro-componentplaced or formed inside another structure, such as placing a sphericalmicro-component inside a cylindrical-shaped structure. In a colorlight-emitting panel, each cylindrical-shaped structure may holdmicro-components configured to emit a single color of visible light ormultiple colors arranged red, green, blue, or in some other suitablecolor arrangement.

In its most basic form, each micro-component 40 includes a shell 50filled with a plasma-forming gas or gas mixture 45. While aplasma-forming gas or gas mixture 45 is used in a preferred embodiment,any other material capable of providing luminescence is alsocontemplated, such as an electro-luminescent material, organiclight-emitting diodes (OLEDs), or an electro-phoretic material. Theshell 50 may have a diameter ranging from micrometers to centimeters asmeasured across its minor axis, with virtually no limitation as to itssize as measured across its major axis. For example, acylindrical-shaped micro-component may be only 100 microns in diameteracross its minor axis, but may be hundreds of meters long across itsmajor axis. In a preferred embodiment, the outside diameter of theshell, as measured across its minor axis, is from 100 microns to 300microns. When a sufficiently large voltage is applied across themicro-component the gas or gas mixture ionizes forming plasma andemitting radiation.

A cavity 55 formed within and/or on a substrate provides the basicsocket 30 structure. The cavity 55 may be any shape and size. Asdepicted in FIGS. 3A-3J, the shape of the cavity 55 may include, but isnot limited to, a cube 100, a cone 110, a conical frustum 120, aparaboloid 130, spherical 140, cylindrical 150, a pyramid 160, apyramidal frustum 170, a parallelepiped 180, or a prism 190. Inaddition, in another embodiment of the present invention as shown inFIG. 12, the socket 30 may be formed as a type of male-female connectorwith a male micro-component 40 and a female cavity 55. The malemicro-component 40 and female cavity 55 are formed to have complimentaryshapes. As shown in FIG. 12, as an example, both the cavity andmicro-component have complimentary cylindrical shapes. The opening 35 ofthe female cavity is formed such that the opening is smaller than thediameter d of the male micro-component. The larger diameter malemicro-component can be forced through the smaller opening of the femalecavity 55 so that the male micro-component 40 is locked/held in thecavity and automatically aligned in the socket with respect to at leastone electrode 500 disposed therein. This arrangement provides an addeddegree of flexibility for micro-component placement. In anotherembodiment, this socket structure provides a means by which cylindricalmicro-components may be fed through the sockets on a row-by-row basis orin the case of a single long cylindrical micro-component (although othershapes would work equally well) fed/woven throughout the entirelight-emitting panel.

The size and shape of the socket 30 influences the performance andcharacteristics of the light-emitting panel and are selected to optimizethe panel's efficiency of operation. In addition, socket geometry may beselected based on the shape and size of the micro-component to optimizethe surface contact between the micro-component and the socket and/or toensure connectivity of the micro-component and the electrodes disposedon or within the socket. Further, the size and shape of the sockets 30may be chosen to optimize photon generation and provide increasedluminosity and radiation transport efficiency.

As shown by example in FIGS. 4 and 5, the size and shape may be chosento provide a field of view 400 with a specific angle θ, such that amicro-component 40 disposed in a deep socket 30 may provide morecollimated light and hence a narrower viewing angle θ (FIG. 4), while amicro-component 40 disposed in a shallow socket 30 may provide a widerviewing angle θ (FIG. 5). That is to say, the cavity may be sized, forexample, so that its depth subsumes a micro-component that is depositedwithin a socket, or it may be made shallow so that a micro-component isonly partially disposed within a socket.

There are a variety of coatings 350 that may be at least partially addedto a socket that also influence the performance and characteristics ofthe light-emitting panel. Types of coatings 350 include, but are notlimited to, adhesives, bonding agents, coatings used to convert UV lightto visible light, coatings used as reflecting filters, and coatings usedas band-gap filters. One skilled in the art will recognize that othercoatings may also be used. The coatings 350 may be applied to the insideof the socket 30 by differential stripping, lithographic process,sputtering, laser deposition, chemical deposition, vapor deposition, ordeposition using ink jet technology. One skilled in the art will realizethat other methods of coating the inside of the socket 30 may be used.Alternatively, or in conjunction with the variety of socket coatings350, a micro-component 40 may also be coated with a variety of coatings300. These micro-component coatings 300 include, but are not limited to,coatings used to convert UV light to visible light, coatings used asreflecting filters, and coatings used as band-gap filters.

In order to assist placing/holding a micro-component 40 or plurality ofmicro-components in a socket 30, a socket 30 may contain a bonding agentor an adhesive. The bonding agent or adhesive may readily hold amicro-component or plurality of micro-components in a socket or mayrequire additional activation energy to secure the micro-components orplurality of micro-components in a socket. In an embodiment of thepresent invention, where the micro-component is configured to emit UVlight, the inside of each of the sockets 30 is at least partially coatedwith phosphor in order to convert the UV light to visible light. In acolor light-emitting panel, in accordance with another embodiment, red,green, and blue phosphors are used to create alternating red, green, andblue, pixels/subpixels, respectively. By combining these colors atvarying intensities all colors can be formed. In another embodiment, thephosphor coating may be combined with an adhesive so that the adhesiveacts as a binder for the phosphor and also binds the micro-component 40to the socket 30 when it is cured. In addition, the socket 30 may becoated with a reflective material, including, but not limited to,optical dielectric stacks, to provide an increase in luminosity, bydirecting radiation traveling in the direction of the substrate in whichthe sockets are formed out through the field of view 400 of thelight-emitting panel.

In an embodiment for a method of making a light-emitting panel includinga plurality of sockets, a cavity 55 is formed, or patterned, in asubstrate 10 to create a basic socket shape. The cavity may be formed inany suitable shape and size by any combination of physically,mechanically, thermally, electrically, optically, or chemicallydeforming the substrate. Disposed proximate to, and/or in, each socketmay be a variety of enhancement materials 325. The enhancement materials325 include, but are not limited to, anti-glare coatings, touchsensitive surfaces, contrast enhancement coatings, protective coatings,transistors, integrated-circuits, semiconductor devices, inductors,capacitors, resistors, diodes, control electronics, drive electronics,pulse-forming networks, pulse compressors, pulse transformers, andtuned-circuits.

In another embodiment of the present invention for a method of making alight-emitting panel including a plurality of sockets, a socket 30 isformed by disposing a plurality of material layers 60 to form a firstsubstrate 10, disposing at least one electrode either directly on thefirst substrate 10, within the material layers or any combinationthereof, and selectively removing a portion of the material layers 60 tocreate a cavity. The material layers 60 include any combination, inwhole or in part, of dielectric materials, metals, and enhancementmaterials 325. The enhancement materials 325 include, but are notlimited to, anti-glare coatings, touch sensitive surfaces, contrastenhancement coatings, protective coatings, transistors,integrated-circuits, semiconductor devices, inductors, capacitors,resistors, diodes, control electronics, drive electronics, pulse-formingnetworks, pulse compressors, pulse transformers, and tuned-circuits. Theplacement of the material layers 60 may be accomplished by any transferprocess, photolithography, sputtering, laser deposition, chemicaldeposition, vapor deposition, or deposition using ink jet technology.One of general skill in the art will recognize other appropriate methodsof disposing a plurality of material layers on a substrate. The cavity55 may be formed in the material layers 60 by a variety of methodsincluding, but not limited to, wet or dry etching, photolithography,laser heat treatment, thermal form, mechanical punch, embossing,stamping-out, drilling, electroforming or by dimpling.

In another embodiment of the present invention for a method of making alight-emitting panel including a plurality of sockets, a socket 30 isformed by patterning a cavity 55 in a first substrate 10, disposing aplurality of material layers 65 on the first substrate 10 so that thematerial layers 65 conform to the cavity 55, and disposing at least oneelectrode on the first substrate 10, within the material layers 65, orany combination thereof. The cavity may be formed in any suitable shapeand size by any combination of physically, mechanically, thermally,electrically, optically, or chemically deforming the substrate. Thematerial layers 65 include any combination, in whole or in part, ofdielectric materials, metals, and enhancement materials 325. Theenhancement materials 325 include, but are not limited to, anti-glarecoatings, touch sensitive surfaces, contrast enhancement coatings,protective coatings, transistors, integrated-circuits, semiconductordevices, inductors, capacitors, resistors, diodes, control electronics,drive electronics, pulse-forming networks, pulse compressors, pulsetransformers, and tuned-circuits. The placement of the material layers65 may be accomplished by any transfer process, photolithography,sputtering, laser deposition, chemical deposition, vapor deposition, ordeposition using ink jet technology. One of general skill in the artwill recognize other appropriate methods of disposing a plurality ofmaterial layers on a substrate.

In another embodiment of the present invention for a method of making alight-emitting panel including a plurality of sockets, a socket 30 isformed by disposing a plurality of material layers 66 on a firstsubstrate 10 and disposing at least one electrode on the first substrate10, within the material layers 66, or any combination thereof. Each ofthe material layers includes a preformed aperture 56 that extendsthrough the entire material layer. The apertures may be of the same sizeor may be of different sizes. The plurality of material layers 66 aredisposed on the first substrate with the apertures in alignment therebyforming a cavity 55. The material layers 66 include any combination, inwhole or in part, of dielectric materials, metals, and enhancementmaterials 325. The enhancement materials 325 include, but are notlimited to, anti-glare coatings, touch sensitive surfaces, contrastenhancement coatings, protective coatings, transistors,integrated-circuits, semiconductor devices, inductors, capacitors,resistors, diodes, control electronics, drive electronics, pulse-formingnetworks, pulse compressors, pulse transformers, and tuned-circuits. Theplacement of the material layers 66 may be accomplished by any transferprocess, photolithography, sputtering, laser deposition, chemicaldeposition, vapor deposition, or deposition using ink jet technology.One of general skill in the art will recognize other appropriate methodsof disposing a plurality of material layers on a substrate.

The electrical potential necessary to energize a micro-component 40 issupplied via at least two electrodes. In a general embodiment of thepresent invention, a light-emitting panel includes a plurality ofelectrodes, wherein at least two electrodes are adhered to only thefirst substrate, only the second substrate or at least one electrode isadhered to each of the first substrate and the second substrate andwherein the electrodes are arranged so that voltage applied to theelectrodes causes one or more micro-components to emit radiation. Inanother general embodiment, a light-emitting panel includes a pluralityof electrodes, wherein at least two electrodes are arranged so thatvoltage supplied to the electrodes cause one or more micro-components toemit radiation throughout the field of view of the light-emitting panelwithout crossing either of the electrodes.

In an embodiment where the cavities 55 are patterned on the firstsubstrate 10 so that the cavities are formed in the first substrate, atleast two electrodes may be disposed on the first substrate 10, thesecond substrate 20, or any combination thereof. In exemplaryembodiments as shown in FIGS. 1 and 2, a sustain electrode 70 is adheredon the second substrate 20 and an address electrode 80 is adhered on thefirst substrate 10. In a preferred embodiment, at least one electrodeadhered to the first substrate 10 is at least partly disposed within thesocket (FIGS. 1 and 2).

In an embodiment where the first substrate 10 includes a plurality ofmaterial layers 60 and the cavities 55 are formed by selectivelyremoving a portion of the material layers, at least two electrodes maybe disposed on the first substrate 10, disposed within the materiallayers 60, disposed on the second substrate 20, or any combinationthereof. In one embodiment, as shown in FIG. 6A, a first addresselectrode 80 is disposed within the material layers 60, a first sustainelectrode 70 is disposed within the material layers 60, and a secondsustain electrode 75 is disposed within the material layers 60, suchthat the first sustain electrode and the second sustain electrode are ina co-planar configuration. FIG. 6B is a cut-away of FIG. 6A showing thearrangement of the co-planar sustain electrodes 70 and 75. In anotherembodiment, as shown in FIG. 7A, a first sustain electrode 70 isdisposed on the first substrate 10, a first address electrode 80 isdisposed within the material layers 60, and a second sustain electrode75 is disposed within the material layers 60, such that the firstaddress electrode is located between the first sustain electrode and thesecond sustain electrode in a mid-plane configuration. FIG. 7B is acut-away of FIG. 7A showing the first sustain electrode 70. As seen inFIG. 8, in a preferred embodiment of the present invention, a firstsustain electrode 70 is disposed within the material layers 60, a firstaddress electrode 80 is disposed within the material layers 60, a secondaddress electrode 85 is disposed within the material layers 60, and asecond sustain electrode 75 is disposed within the material layers 60,such that the first address electrode and the second address electrodeare located between the first sustain electrode and the second sustainelectrode.

In an embodiment where the cavities 55 are patterned on the firstsubstrate 10 and a plurality of material layers 65 are disposed on thefirst substrate 10 so that the material layers conform to the cavities55, at least two electrodes may be disposed on the first substrate 10,at least partially disposed within the material layers 65, disposed onthe second substrate 20, or any combination thereof. In one embodiment,as shown in FIG. 9, a first address electrode 80 is disposed on thefirst substrate 10, a first sustain electrode 70 is disposed within thematerial layers 65, and a second sustain electrode 75 is disposed withinthe material layers 65, such that the first sustain electrode and thesecond sustain electrode are in a co-planar configuration. In anotherembodiment, as shown in FIG. 10, a first sustain electrode 70 isdisposed on the first substrate 10, a first address electrode 80 isdisposed within the material layers 65, and a second sustain electrode75 is disposed within the material layers 65, such that the firstaddress electrode is located between the first sustain electrode and thesecond sustain electrode in a mid-plane configuration. As seen in FIG.11, in a preferred embodiment of the present invention, a first sustainelectrode 70 is disposed on the first substrate 10, a first addresselectrode 80 is disposed within the material layers 65, a second addresselectrode 85 is disposed within the material layers 65, and a secondsustain electrode 75 is disposed within the material layers 65, suchthat the first address electrode and the second address electrode arelocated between the first sustain electrode and the second sustainelectrode.

In an embodiment where a plurality of material layers 66 with alignedapertures 56 are disposed on a first substrate 10 thereby creating thecavities 55, at least two electrodes may be disposed on the firstsubstrate 10, at least partially disposed within the material layers 65,disposed on the second substrate 20, or any combination thereof. In oneembodiment, as shown in FIG. 13, a first address electrode 80 isdisposed on the first substrate 10, a first sustain electrode 70 isdisposed within the material layers 66, and a second sustain electrode75 is disposed within the material layers 66, such that the firstsustain electrode and the second sustain electrode are in a co-planarconfiguration. In another embodiment, as shown in FIG. 14, a firstsustain electrode 70 is disposed on the first substrate 10, a firstaddress electrode 80 is disposed within the material layers 66, and asecond sustain electrode 75 is disposed within the material layers 66,such that the first address electrode is located between the firstsustain electrode and the second sustain electrode in a mid-planeconfiguration. As seen in FIG. 15, in a preferred embodiment of thepresent invention, a first sustain electrode 70 is disposed on the firstsubstrate 10, a first address electrode 80 is disposed within thematerial layers 66, a second address electrode 85 is disposed within thematerial layers 66, and a second sustain electrode 75 is disposed withinthe material layers 66, such that the first address electrode and thesecond address electrode are located between the first sustain electrodeand the second sustain electrode.

Other embodiments and uses of the present invention will be apparent tothose skilled in the art from consideration of this application andpractice of the invention disclosed herein. The present description andexamples should be considered exemplary only, with the true scope andspirit of the invention being indicated by the following claims. As willbe understood by those of ordinary skill in the art, variations andmodifications of each of the disclosed embodiments, includingcombinations thereof, can be made within the scope of this invention asdefined by the following claims.

1. A energy-detecting light-emitting panel comprising: a firstsubstrate; a second substrate opposed to the first substrate; aplurality of sockets, each socket comprising a cavity and wherein thecavity is patterned on the first substrate so as to be formed in thefirst substrate; a plurality of micro-components, each micro-componentcontaining an ionizable gas or gas-mixture, wherein at least onemicro-component of the plurality of micro-components is at leastpartially disposed in each socket; a plurality of electrodes, wherein atleast two electrodes of the plurality of electrodes are adhered to onlythe first substrate, only the second substrate, or at least oneelectrode of the at least two electrodes is adhered to each of the firstsubstrate and the second substrate; wherein a voltage is applied to theat least two electrodes, which voltage is just below a write potentialrequired for ionization of gas or gas-mixture, and wherein when at leasta portion of the panel is exposed to an external energy, the externalenergy causes the gas or gas-mixture to ionize and at least onemicro-component to thereby emit radiation.
 2. The energy-detectinglight-emitting panel of claim 1, wherein the external energy is photons.3. The energy-detecting light-emitting panel of claim 1, wherein thedepth of the cavity is selected to achieve a specific field of view forthe light-emitting display.
 4. The energy-detecting light-emitting panelof claim 1, wherein at least one socket is at least partially coatedwith phosphor.
 5. The energy-detecting light-emitting panel of claim 1,wherein at least one socket is at least partially coated with areflective material.
 6. The energy-detecting light-emitting panel ofclaim 1, further comprising an adhesive or bonding agent disposed in thecavity.
 7. The energy-detecting light-emitting panel of claim 1, whereinthe plurality of material layers comprise at least one enhancementmaterial selected from the group consisting of anti-glare coatings,touch sensitive surfaces, contrast enhancement coatings, and protectivecoatings.
 8. The energy-detecting light-emitting panel of claim 1,wherein the plurality of material layers comprise at least oneenhancement material selected from the group consisting of transistors,integrated-circuits, semiconductor devices, inductors, capacitors,resistors, diodes, control electronics, drive electronics, pulse-formingnetworks, pulse compressors, pulse transformers, and tuned-circuits. 9.A light-emitting panel comprising: a first substrate; a second substrateopposed to the first substrate; a plurality of sockets, wherein eachsocket of the plurality of sockets comprises a cavity and wherein thecavity is patterned on the first substrate so as to be formed in thefirst substrate; a plurality of micro-components, wherein at least onemicro-component of the plurality of micro-components is at leastpartially disposed in each socket; a plurality of electrodes, wherein atleast two electrodes of the plurality of electrodes are adhered to onlythe first substrate, only the second substrate, or at least oneelectrode is adhered to the each of the first substrate and the secondsubstrate and wherein the at least two electrodes are arranged so thatvoltage supplied to the at least two electrodes causes one or moremicro-components to emit radiation.
 10. The light-emitting panel ofclaim 9, wherein the cavity is in a shape selected from the groupconsisting of a cube, a cone, a conical frustum, a paraboloid,spherical, cylindrical, a pyramid, a pyramidal frustum, aparallelepiped, and a prism.
 11. The light-emitting panel of claim 9,wherein the depth of the cavity is selected to achieve a specific fieldof view for the light-emitting display.
 12. The light-emitting panel ofclaim 9, wherein at least one socket is at least partially coated withphosphor.
 13. The light-emitting panel of claim 9, wherein at least onesocket is at least partially coated with a reflective material.
 14. Thelight-emitting panel of claim 9, further comprising an adhesive orbonding agent disposed in the cavity.
 15. The light-emitting panel ofclaim 9, wherein at least one socket comprises at least one enhancementmaterial selected from the group consisting of anti-glare coatings,touch sensitive surfaces, contrast enhancement coatings, and protectivecoatings.
 16. The light-emitting panel of claim 9, wherein at least onesocket comprises at least one enhancement material selected from thegroup consisting of transistors, integrated-circuits, semiconductordevices, inductors, capacitors, resistors, diodes, control electronics,drive electronics, pulse-forming networks, pulse compressors, pulsetransformers, and tuned-circuits.
 17. A light-emitting panel comprising:a first substrate; a second substrate opposed to the first substrate; aplurality of sockets, wherein each socket of the plurality of socketscomprises: a cavity, wherein the cavity is patterned on the firstsubstrate so as to be formed in the first substrate; and a plurality ofmaterial layers, wherein the plurality of material layers are disposedon the first substrate such that the plurality of material layersconform to the shape of the cavity of each socket; a plurality ofmicro-components, wherein at least one micro-component of the pluralityof micro-components is at least partially disposed in each socket; aplurality of electrodes, wherein at least one electrode of the pluralityof electrodes is disposed within the material layers.
 18. Thelight-emitting display of claim 17, wherein at least two electrodes ofthe plurality of electrodes are arranged so that voltage supplied to theat least two electrodes causes one or more micro-components to emitradiation throughout the field of view of the light-emitting panelwithout crossing the at least two electrodes.
 19. The light-emittingpanel of claim 17, wherein the shape of the cavity is selected from thegroup consisting of a cube, a cone, a conical frustum, a paraboloid,spherical, cylindrical, a pyramid, a pyramidal frustum, aparallelepiped, and a prism.
 20. The light-emitting panel of claim 17,wherein the depth of the cavity is selected to achieve a specific fieldof view for the light-emitting display.
 21. The light-emitting panel ofclaim 17, wherein at least one socket is at least partially coated withphosphor.
 22. The light-emitting panel of claim 17, wherein at least onesocket is at least partially coated with a reflective material.
 23. Thelight-emitting panel of claim 17, further comprising an adhesive orbonding agent disposed in each socket.
 24. The light-emitting panel ofclaim 17, wherein the material layers comprise at least one enhancementmaterial selected from the group consisting of anti-glare coatings,touch sensitive surfaces, contrast enhancement coatings, and protectivecoatings.
 25. The light-emitting panel of claim 17, wherein the materiallayers comprise at least one enhancement material selected from thegroup consisting of transistors, integrated-circuits, semiconductordevices, inductors, capacitors, resistors, diodes, control electronics,drive electronics, pulse-forming networks, pulse compressors, pulsetransformers, and tuned-circuits.